eMMC eMCP Reballing Stencil kit 4 in 1 BGA ReBalling Stencils eMCP162 eMMP186 eMMC153 eMCP169

eMMC eMCP Reballing Stencil kit 4 in 1 BGA ReBalling Stencils eMCP162 eMMP186 eMMC153 eMCP169
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eMMC eMCP Reballing Stencil kit 4 in 1 BGA ReBalling Stencils eMCP162 eMMP186 eMMC153 eMCP169

  • Model: ST306
  • Shipping Weight: 0.15kg
  • Units in Stock: 997

Price:   $88.00

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4 in 1 BGA ReBalling Stencils for eMMC153 / eMMC169 / eMCP162 / eMCP186,  eMMC/eMCP Reballin Template Stencil for BGA Rework Station, 4 in 1 bga reballing kit and eMMC / eMCP plant Stencil.



 eMMC/eMCP Reballing Stencil kit 4 in 1 BGA ReBalling Stencils


    4 in 1 design bga reballing kit, capable apply to eMMC153/eMMC169, eMCP162 /eMMP186 nand flash IC reballing    at the same time
    Moldcore designs with dismountable, easy to change through two screws, change the moldcore can meantime support different size eMMC153/eMCP169 IC reballing
    Moldcore uses high accuracy IC Grinding Machine, accurate IC location

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