4 in 1 BGA ReBalling Stencils for eMMC153 / eMMC169 / eMCP162 / eMCP186,  eMMC/eMCP Reballin Template Stencil for BGA Rework Station, 4 in 1 bga reballing kit and eMMC / eMCP plant Stencil.

 eMMC/eMCP Reballing Stencil kit 4 in 1 BGA ReBalling Stencils

    4 in 1 design bga reballing kit, capable apply to eMMC153/eMMC169, eMCP162 /eMMP186 nand flash IC reballing    at the same time
    Moldcore designs with dismountable, easy to change through two screws, change the moldcore can meantime support different size eMMC153/eMCP169 IC reballing
    Moldcore uses high accuracy IC Grinding Machine, accurate IC location