QUICK 7610 is china brand new improved BGA Infrared BGA Rework Station. QUICK 7610 BGA rework station is required large thermal capacity of PCB or BGA lead-free processes. QUICK 7610 BGA rework system can be easily handling and safety.

New improved version QUICK 7610 BGA rework station from China QUICK factory, Infrared BGA Rework Station

China Brand QUICK 7610 is new improved version BGA rework system, QUICK 7610 BGA rework station is infrared sensor technology and temperature closed-loop control principle, QUICK 7610 BGA rework system provide ideal heat distribution and the right of the peak temperature, require large thermal capacity of PCB or BGA lead-free processes, etc. can be easily handling, safety, preciselysurface mount components for repair and welding.

BGA QUICK 7610 precise non-contact infrared temperature sensors to control surface temperature, temperature control accurate, sensitive, and in order to achieve a more rigorous process window requirements for lead-free soldering; their top and bottom are dark red outer heating medium wavelength heating, a uniform heat distribution, to thereby obtain the best control of the welding process and non-destructive, can be repeated production of PCB temperature; adjustable aperture, of the infrared heater below the adjacent parts can be protected on the PCB on the heating of the temperature-sensitive element, while You do not need to rework nozzle.

QUICK 7610 BGA rework station Features:

1 using the heated the opening formula infared outside for the closed loop control by the BGA surface of the non-contact infrared sensor senses the temperature change, and ensure accurate temperature process window, uniform heat distribution.
2 using a large area at the bottom of infrared heating, prevent PCB deformation, warping.

Specifications for QUICK 7610 BGA rework station:

1.Total power: 2400W (max)
2.Bottom preheating power: 1600W (infrared ceramic heating plate)
3.Top heating power: 720W (infrared heating tube, wavelength about 2 to 8μm, size: 60 * 60mm)
4.Bottom radiation preheating size: 260 * 260mm
5.Maximum PCB size: 420mm * 500mm
6 Max BGA size: 60 * 60mm
Newsletter: standard RS-232C (online) and PC / USB interface optional
8 infrared temperature sensor: 0 ~ 300 °C (temperature range)
9.Dimensions: 785 * 532 * 518mm

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